primary applications of PCB via filling

A via acts as an electrical connection between different layers of a PCB. A via hole is a drilled hole that can be filled with either conductive or non-conductive material. The primary applications of via filling include transferring signal from one layer to another, and providing a path for heat and current. The type of via fill a manufacturer chooses to use will affect both the board’s cost and production time.

Conductive filled vias (copper or silver) are most often used when high levels of current or heat need to be transferred across the board. Their metallic nature wicks heat away from hot components and distributes it throughout the rest of the board, much like a radiator. This conductive fill also improves the quality of current conduction in vias, and is especially helpful for breaking out connections for close-pitch SMT components.

When choosing between a conductive and non-conductive pcb via filling, most designers settle on a non-conductive epoxy. This is because it offers a better CTE match to the laminate material that surrounds the via hole, which will reduce the chance of stress fractures caused by unequal expansion and contraction of metal and plastic as the board heats up and cools.

While a conductive fill is useful for transferring signal and heat, it’s not always possible or desirable to do so. In some cases, the conductive fill might interfere with a component’s performance or cause damage to the board. This is where a non-conductive via fill comes in handy; it allows the same signal to pass through as the conductive fill, but it doesn’t impact the integrity of the circuit.

What are the primary applications of PCB via filling?

The most common way to fill a drilled hole is by using solder. Solder can be applied to the hole with either reflow or wave soldering, and it will provide a solid conductive path from one side of the board to the other. Solder-filled vias are a great option for simple designs, and they’re quick and easy to apply.

Another method of filling a via is by using a conductive paste. This is a dispensable material that contains metal particles suspended in a binder, and it can be applied to the vias with stencil printing or syringe-like methods. A conductive paste will also be cured at elevated temperatures, and it can offer similar advantages to a conductive epoxy fill.

If a bare PCB design has a lot of components, then it’s important to minimize the number of through holes. Instead, the manufacturer can choose to use micro-vias to increase routing density and reduce the overall footprint of the circuit board. Micro-vias are smaller than through-holes, and they allow manufacturers to connect more components in a shorter space.

If you are looking for a reliable supplier to manufacture your next printed circuit board, WellPCB has a team of highly skilled engineers ready to help. They’ll ensure that your board has the right mix of features, and they can deliver it in the shortest possible timeframe. Contact them today to discuss your project.